The 5700X is built on TSMC’s 7nm process using the Vermeer chiplet architecture — a single CCD with all 8 active Zen 3 cores sharing a unified 32MB L3 cache, paired with a 12nm I/O die handling memory and connectivity. The unified cache topology keeps inter-core latency low, which benefits gaming workloads in particular — all threads have fast, equal access to the shared cache pool. Running at just 65W TDP, the 5700X delivers eight cores of Zen 3 performance at a power envelope you’d more typically expect from a six-core processor, making it a strong choice for quiet or thermally constrained builds.

Gaming and Productivity Value

With Precision Boost Overdrive enabled, the 5700X pushes close to the performance of the 5800X in both single and multi-threaded workloads, making it one of the better value propositions in AMD’s AM4 lineup for builders who want eight cores without paying a premium. ECC memory support is present for reliability-conscious workloads, and the unlocked multiplier means frequency overclocking is fully available. The 5700X handles gaming, streaming, content creation, software development, and general multitasking confidently across all eight cores.

Platform & Compatibility

The 5700X supports PCIe 4.0 connectivity and DDR4 memory at up to 3200 MT/s officially, with overclocking headroom beyond that on compatible boards. It’s compatible with the full range of AMD 300, 400, and 500-series AM4 motherboards with a BIOS update, making it a straightforward drop-in upgrade for existing systems. Precision Boost Overdrive, Curve Optimizer, and Ryzen Master are all supported for those who want to tune further.

No integrated graphics — a discrete GPU must be installed for display output.

No cooler included — an aftermarket tower air cooler or 240mm AIO is recommended.

Key Highlights:

• 8 cores / 16 threads, Zen 3 architecture (7nm, Vermeer)
• Base clock: 3.4 GHz | Boost clock: up to 4.6 GHz
• 32MB L3 cache + 4MB L2 cache
• AM4 socket | DDR4 support | PCIe 4.0
• 65W TDP
• ECC memory supported
• Precision Boost Overdrive, Curve Optimizer & Ryzen Master supported
• Unlocked multiplier — overclocking supported
• No integrated graphics — discrete GPU required
• Compatible with X570, X470, X370, B550, B450, B350, and A520 motherboards (BIOS update may be required on older boards)

Proudly sold by the Ringwood Digital Store.

The 7600 is a Raphael-series processor built on TSMC’s 5nm process for the CCD and 6nm for the I/O die, using the same Zen 4 chiplet design as the rest of the Ryzen 7000 lineup. All six cores share a unified 32MB L3 cache, keeping inter-core latency low and gaming performance strong across the full core count. At 65W TDP, the 7600 runs significantly cooler and quieter than the 7600X’s 105W configuration — and in most real-world workloads, particularly gaming, the performance gap between the two is narrow enough to make the 7600 the more sensible purchase for the majority of users. The included Wraith Stealth cooler handles the 65W envelope comfortably out of the box.

Platform Performance and Tuning

The 7600 sits on the AM5 platform with full DDR5 and PCIe 5.0 support, giving you high-bandwidth connectivity for modern GPUs and NVMe storage. ECC memory is supported for reliability-sensitive workloads, and the unlocked multiplier means overclocking is fully available for those who want to push further. AMD EXPO memory overclocking, Precision Boost Overdrive, Curve Optimizer voltage offsets, and Ryzen Master support are all present. The integrated RDNA 2 iGPU provides basic display output and allows the system to POST without a discrete GPU installed.

Platform & Compatibility

The 7600 is compatible with the full range of AMD 600-series and 800-series AM5 motherboards, from the accessible A620 boards all the way up to X870E, making it a flexible and future-friendly platform entry point. A discrete GPU is recommended for gaming and any graphically demanding workload.

Key Highlights:

• 6 cores / 12 threads, Zen 4 architecture (5nm, Raphael)
• Base clock: 3.8 GHz | Boost clock: up to 5.1 GHz
• 32MB L3 cache + 6MB L2 cache
• AM5 socket | DDR5 support | PCIe 5.0
• 65W TDP
• ECC memory supported
• AMD EXPO, Precision Boost Overdrive & Curve Optimizer supported
• Unlocked multiplier — overclocking supported
• Integrated AMD Radeon graphics (RDNA 2)
• Compatible with X870, X870E, X670, X670E, B650, B650E, and A620 motherboards

Proudly sold by the Ringwood Digital Store.

The 7500X3D’s six cores are built on TSMC’s 5nm process with the I/O die on 6nm, carrying 96MB of total L3 cache — 64MB of which is 3D V-Cache stacked onto the CCD. The result is a processor that looks modest on paper by clock speed standards but punches well above its weight in gaming workloads. Despite the 7600X having a significantly higher boost clock, the 7500X3D outperforms it in many cache-sensitive titles — a clear demonstration that V-Cache’s latency and bandwidth advantages compound regardless of frequency. In cache-hungry titles, the 7500X3D was on average just 11% slower than the 7800X3D despite being clocked 10% lower and carrying 25% fewer cores, making it a compelling budget entry into the X3D ecosystem.

Thermals and Efficiency

At 65W TDP, the 7500X3D is the most thermally efficient X3D processor AMD has produced to date. A 65W TDP means you won’t need a 360mm AIO to keep it tamed — a good mid-range tower air cooler handles it comfortably, keeping build costs and noise levels down. This makes it particularly well-suited to compact mid-tower and small-form-factor gaming builds where thermal headroom is limited.

Platform & Connectivity

As an AM5 chip, the 7500X3D features DDR5 memory support, PCIe 5.0 lanes, and an integrated RDNA 2 iGPU for basic display output — useful for troubleshooting or compact builds without a discrete GPU temporarily installed. AMD EXPO memory overclocking, Precision Boost Overdrive, and Curve Optimizer voltage offsets are all supported, giving you meaningful tuning options for memory and boost behaviour. Note that the CPU multiplier is locked on this chip — frequency overclocking via multiplier is not available.

No cooler included — a mid-range tower air cooler is sufficient for this 65W processor.

Key Highlights:

• 6 cores / 12 threads, Zen 4 architecture (5nm)
• Base clock: 4.0 GHz | Boost clock: up to 4.5 GHz
• 96MB L3 cache (3D V-Cache, 64MB stacked) + 6MB L2 cache
• AM5 socket | DDR5 support | PCIe 5.0
• 65W TDP
• AMD EXPO & Precision Boost Overdrive supported
• Multiplier locked — CPU frequency overclocking not available
• Integrated AMD Radeon graphics
• Compatible with X870, X870E, X670, X670E, B650, B650E, and A620 motherboards

Proudly sold by the Ringwood Digital Store.

The Ryzen 7 7700 is built on the same Raphael silicon as the 7700X, using the same multi-chip module combining a 6nm I/O die with a 5nm CCD compute die — the key difference being a reduced TDP of 65W versus the 7700X’s 105W, alongside adjusted clock speeds. The practical result is a processor that runs significantly cooler and quieter under load while delivering performance that tracks closely with its higher-TDP sibling in most real-world workloads. In multi-threaded testing, the Ryzen 7 7700 is among the most energy-efficient desktop processors available, making it a smart choice for builds where noise, heat, and power consumption are genuine priorities alongside raw performance.

Capable Across Gaming and Productivity

Eight full Zen 4 cores with SMT handle gaming, streaming, content creation, and general productivity workloads confidently. The single-CCD design keeps inter-core latency low, which benefits gaming specifically — all threads have fast, equal access to the shared 32MB L3 cache. The unlocked multiplier, adjustable power limits, and full memory overclocking settings are all present, giving you complete tuning flexibility despite the non-X designation. AMD EXPO, Precision Boost Overdrive, and Curve Optimizer are all supported.

Platform & Connectivity

The 7700 slots into the AM5 socket with full DDR5 memory and PCIe 5.0 support, and is compatible with the full range of AMD 600-series and 800-series motherboards. The integrated RDNA 2 iGPU handles display output and basic productivity tasks without a discrete GPU in the system. ECC memory is supported, adding value for reliability-focused builds in small business and professional environments.

Key Highlights:

• 8 cores / 16 threads, Zen 4 architecture (5nm)
• Base clock: 3.8 GHz | Boost clock: up to 5.3 GHz
• 32MB L3 cache + 8MB L2 cache
• AM5 socket | DDR5 support | PCIe 5.0
• 65W TDP
• ECC memory supported
• AMD EXPO, Precision Boost Overdrive & Curve Optimizer supported
• Unlocked multiplier — overclocking supported
• Integrated AMD Radeon graphics
• Compatible with X870, X870E, X670, X670E, B650, B650E, and A620 motherboards

Proudly sold by the Ringwood Digital Store.

The Ryzen 9 7900 is a Raphael-series processor with 12 Zen 4 cores and 24 threads built on TSMC’s 5nm process, with the I/O die manufactured on a 6nm node — a chiplet design that carries two CCDs each housing six active cores. At 65W TDP it is the fastest 12-core desktop processor at that power level, making it a compelling option for mid-tower and small-form-factor builds where heat and power draw are genuine considerations. Zen 4’s IPC improvements over the previous generation mean that the lower clock speeds relative to the 7900X translate to only a modest real-world performance gap.

Performance & Efficiency

The Ryzen 9 7900 only loses around 10% of full performance compared to the 7900X, yet carries a lower price and includes a Wraith Prism cooler in the box — making it a strong value proposition for productivity-focused builds. Multi-threaded workloads including video encoding, 3D rendering, software compilation, and virtualisation all benefit from the 12-core configuration, while the Zen 4 single-core performance holds up well in gaming paired with a capable discrete GPU. ECC memory support adds utility for data-sensitive workloads and small business environments.

Platform & Connectivity

The 7900 sits on the AM5 platform with full DDR5 memory and PCIe 5.0 support, and is compatible with the complete range of AMD 600-series and 800-series motherboards. The integrated RDNA 2 iGPU provides display output without a discrete GPU. The unlocked multiplier makes overclocking straightforward, and AMD EXPO memory overclocking, Precision Boost Overdrive, and Curve Optimizer are all supported for those who want to push further.

Key Highlights:

• 12 cores / 24 threads, Zen 4 architecture (5nm)
• Base clock: 3.7 GHz | Boost clock: up to 5.4 GHz
• 64MB L3 cache + 12MB L2 cache
• AM5 socket | DDR5 support | PCIe 5.0
• 65W TDP
• ECC memory supported
• AMD EXPO, Precision Boost Overdrive & Curve Optimizer supported
• Unlocked multiplier — overclocking supported
• Integrated AMD Radeon graphics
• Compatible with X870, X870E, X670, X670E, B650, B650E, and A620 motherboards

Proudly sold by the Ringwood Digital Store.

The 225F is the no-graphics variant of the Core Ultra 5 225, sharing the same TSMC 3nm compute tile, identical clocks, cache, and power envelope. The “F” designation removes the Xe-LPG integrated graphics tile, making it the right choice for builders who are pairing this chip with a discrete GPU and want to save slightly over the 225 with iGPU. The hybrid core design features 6 Lion Cove P-cores handling demanding, latency-sensitive workloads and 4 Skymont E-cores managing background tasks and multithreading. Intel Thread Director is embedded in silicon, dynamically routing workloads to the correct core type in real time. The multiplier is locked — this is a non-K SKU — but the platform itself is fully capable for builders who don’t need overclocking.

NPU AI Acceleration Still Included

Despite the no-graphics designation, the 225F retains the Intel AI Boost NPU delivering up to 13 TOPS — the same NPU performance as the 225. This means AI-accelerated features in compatible applications remain available, including Windows Studio Effects, OpenVINO workloads, and DirectML-based AI inference, making it a more capable platform entry than older budget processors despite the locked multiplier.

Platform Considerations

The 225F sits on the LGA 1851 socket, requiring an Intel 800-series motherboard — B860, H870, or Z890 boards all work. DDR5 memory up to 6400 MT/s is officially supported in single DIMM-per-channel configurations, and ECC memory is supported on compatible motherboards. PCIe 5.0 and 4.0 provide up to 24 combined lanes for GPU and NVMe storage connectivity. A discrete GPU is required for all display output as there is no integrated graphics.

No integrated graphics — a discrete GPU must be installed for display output.

No cooler included — a quality tower air cooler is sufficient for this 65W processor.

Key Highlights:

• 10 cores (6 P-cores + 4 E-cores) / 10 threads, Arrow Lake Series 2 (TSMC 3nm)
• P-core base: 3.3 GHz | P-core max turbo: 4.9 GHz
• E-core base: 2.7 GHz | E-core max turbo: 4.4 GHz
• 20MB L3 Smart Cache + 22MB L2 cache
• LGA 1851 socket | DDR5 support (up to 6400 MT/s) | PCIe 5.0 & 4.0
• 65W base power / 121W maximum turbo power
• Integrated NPU — up to 13 TOPS for AI workloads
• Intel Thread Director — automatic P-core/E-core workload scheduling
• Multiplier locked — CPU frequency overclocking not available
• ECC memory supported (requires compatible motherboard)
• No integrated graphics — discrete GPU required
• Compatible with Intel 800-series LGA 1851 motherboards (B860, H870, Z890)

Proudly sold by the Ringwood Digital Store.

The 5600GT is part of AMD’s Ryzen 5000 G-Series desktop processor lineup, based on the Cezanne architecture — a monolithic die design that integrates both CPU and GPU cores on a single chip, rather than the chiplet design used by the standard Vermeer-based 5600. This architecture choice is what enables the integrated Radeon graphics, making the 5600GT a genuinely capable processor for systems where a discrete GPU isn’t installed or isn’t needed. The integrated Radeon graphics run at up to 1900 MHz, delivering smooth performance for desktop use, video playback, light creative work, and casual gaming at modest settings.

Performance and Platform Trade-offs

The monolithic Cezanne design means the 5600GT carries 16MB of L3 cache rather than the 32MB found in the chiplet-based 5600, and is limited to PCIe 3.0 rather than PCIe 4.0. In practice, these trade-offs are largely invisible in everyday workloads, and the addition of integrated graphics adds significant real-world value for builds that don’t require a dedicated GPU. All AMD Ryzen 5000 Series processor technologies are present, including Precision Boost 2, Precision Boost Overdrive, and full Ryzen Master support for tuning and personalising performance.

Platform & Compatibility

The 5600GT slots into the AM4 socket and is compatible with a broad range of AMD 300, 400, and 500-series motherboards with a BIOS update, giving builders and upgraders maximum flexibility. DDR4 memory up to 3200 MT/s is officially supported, and the chip is drop-in compatible with any existing AM4 system that supports the 5000 G-Series.

Key Highlights:

• 6 cores / 12 threads, Zen 3 architecture (7nm, Cezanne)
• Base clock: 3.6 GHz | Boost clock: up to 4.6 GHz
• 16MB L3 cache + 3MB L2 cache
• AM4 socket | DDR4 support | PCIe 3.0
• 65W TDP
• Integrated AMD Radeon graphics (up to 1900 MHz) — discrete GPU not required
• Precision Boost 2, Precision Boost Overdrive & Ryzen Master supported
• Unlocked multiplier — overclocking supported
• Compatible with 300, 400, and 500-series AM4 motherboards (BIOS update may be required)

Proudly sold by the Ringwood Digital Store.

The 8600G is built on a single Phoenix die using TSMC’s 4nm process, integrating six full Zen 4 CPU cores and an RDNA 3 Radeon 760M iGPU with 8 GPU cores clocking up to 2.8 GHz, alongside AMD’s Ryzen AI NPU engine — all on one monolithic chip. The RDNA 3 architecture is a substantial leap over the older Vega-based integrated graphics found in previous-generation APUs, bringing hardware ray tracing support and AMD FSR frame generation compatibility. The Radeon 760M delivers approximately 2.9 TFLOPS of FP32 compute, enabling light-to-medium 1080p gaming and solid 720p gaming without any discrete GPU installed — a genuine capability no chiplet-based Ryzen processor can offer.

AI Acceleration and Platform Features

The 8600G includes AMD’s Ryzen AI NPU engine, which accelerates AI workloads in compatible applications using the dedicated Neural Processing Unit alongside the CPU and GPU cores, delivering up to 16 TOPS. AMD EXPO memory overclocking, Precision Boost Overdrive, Curve Optimizer voltage offsets, and full Ryzen Master support are all present. Fast DDR5 memory — ideally DDR5-6000 — pairs particularly well with this chip, as the iGPU shares system memory as its VRAM, and higher memory bandwidth translates directly into improved gaming frame rates.

Platform Considerations

The 8600G sits on the AM5 socket with DDR5 memory and PCIe 4.0 connectivity — note that as a Phoenix architecture APU, it supports PCIe 4.0 rather than the PCIe 5.0 found on Raphael and Granite Ridge chiplet processors. It’s compatible with the full range of AMD 600-series and 800-series AM5 motherboards, and a discrete GPU can be added at any time to step up gaming or workstation performance without changing the CPU or platform.

Key Highlights:

• 6 cores / 12 threads, Zen 4 architecture (4nm, Phoenix)
• Base clock: 4.3 GHz | Boost clock: up to 5.0 GHz
• 16MB L3 cache + 6MB L2 cache
• AM5 socket | DDR5 support | PCIe 4.0
• 65W TDP
• Integrated AMD Radeon 760M graphics (RDNA 3, 8 CUs, up to 2.8 GHz) — discrete GPU not required
• AMD Ryzen AI NPU — up to 16 TOPS
• AMD EXPO, Precision Boost Overdrive & Curve Optimizer supported
• Unlocked multiplier — overclocking supported
• Compatible with X870, X870E, X670, X670E, B650, B650E, and A620 motherboards

Proudly sold by the Ringwood Digital Store.

The i9-14900F is functionally identical to the i9-14900, sharing the same 24-core, 32-thread Raptor Lake Refresh configuration — 8 Hyper-Threaded P-cores and 16 E-cores — at the same 65W base power and 219W maximum turbo power. The “F” designation simply removes the integrated Intel UHD 770 graphics, making it the right pick for any build where a discrete GPU is already part of the plan. Intel Thread Director manages real-time workload allocation between P-cores and E-cores automatically, ensuring demanding games, content creation tools, and background processes each get the right core type without any user configuration.

Boost Technologies and Connectivity

The full boost stack is present: Turbo Boost 2.0, Turbo Boost Max 3.0 targeting the two fastest P-cores at up to 5.6 GHz, Thermal Velocity Boost pushing the single-core peak to 5.8 GHz when thermals allow, and Adaptive Boost for opportunistic all-core frequency uplift. Both DDR4 and DDR5 memory are supported, and PCIe 5.0 and PCIe 4.0 connectivity provide up to 20 combined lanes for GPU and NVMe storage. ECC memory is supported on compatible motherboards. The multiplier is locked — this is not an overclockable SKU.

Platform Compatibility

The i9-14900F sits on the LGA 1700 socket and is compatible with Intel 600-series and 700-series chipset motherboards. The included Laminar RH1 cooler is sufficient for everyday and moderate workloads; a more capable cooler is recommended for sustained heavy loads approaching the 219W turbo ceiling.

No integrated graphics — a discrete GPU must be installed for display output.

Key Highlights:

• 24 cores (8 P-cores + 16 E-cores) / 32 threads, Raptor Lake Refresh (Intel 7)
• P-core base: 2.0 GHz | P-core max turbo: 5.4 GHz | Turbo Boost Max 3.0: 5.6 GHz | Thermal Velocity Boost: 5.8 GHz
• E-core base: 1.5 GHz | E-core max turbo: 4.3 GHz
• 36MB L3 Smart Cache + 32MB L2 cache
• LGA 1700 socket | DDR4 & DDR5 support | PCIe 5.0 & 4.0
• 65W base power / 219W maximum turbo power
• Intel Thread Director — automatic P-core/E-core workload scheduling
• Turbo Boost 2.0, Turbo Boost Max 3.0, Thermal Velocity Boost & Adaptive Boost
• Multiplier locked — CPU frequency overclocking not available
• ECC memory supported (requires compatible motherboard)
• No integrated graphics — discrete GPU required
• Compatible with Intel 700-series and 600-series LGA 1700 motherboards

Proudly sold by the Ringwood Digital Store.

The 8500G is based on AMD’s Phoenix 2 die — a smaller, more cost-efficient monolithic silicon built on TSMC’s 4nm process. Its 6-core configuration is a hybrid arrangement: two full-sized Zen 4 cores capable of sustaining the highest boost frequencies, alongside four physically smaller Zen 4c cores. Importantly, Zen 4c has identical IPC and instruction set architecture to full Zen 4, including SMT support — the difference is lower voltage tolerances limiting peak clock speeds on the smaller cores. All six cores share a unified 16MB L3 cache on a single CCX, which eliminates inter-core latency issues and keeps scheduling straightforward. For everyday workloads — productivity, browsing, media, office applications, and light content creation — the performance difference between the 8500G and the 8600G is minimal.

Integrated Graphics and Platform Trade-offs

The Radeon 740M iGPU carries 4 compute units based on the RDNA 3 architecture, clocking up to 2.8 GHz — a meaningful capability for display output, video playback, and light gaming at 720p to 1080p on reduced settings. It’s a step down from the 8600G’s 8-CU Radeon 760M, but a significant upgrade over the basic RDNA 2 iGPU found in chiplet-based Ryzen 7000 processors. There are a few platform trade-offs worth noting: the PCIe x16 slot runs at electrical PCIe 4.0 x4 rather than the full x16 bandwidth found on Phoenix and Raphael processors, the CPU multiplier is locked limiting frequency overclocking, and the Phoenix 2 silicon does not include an NPU. AMD EXPO memory overclocking and Ryzen Master are still supported, and a discrete GPU can be added at any time.

Platform & Compatibility

The 8500G sits on the AM5 socket with DDR5-5200 memory support and ECC memory capability on compatible motherboards — notable for the most affordable tier of this platform. It’s compatible with the full range of AMD 600-series and 800-series AM5 motherboards, making it the lowest-cost entry into the AM5 ecosystem with a clear upgrade path to higher-tier processors.

Key Highlights:

• 6 cores / 12 threads, Zen 4 + Zen 4c hybrid architecture (4nm, Phoenix 2)
• 2× full Zen 4 cores (up to 5.0 GHz) + 4× Zen 4c cores (3.5 GHz base)
• 16MB L3 cache + 6MB L2 cache
• AM5 socket | DDR5 support | PCIe 4.0 (x16 slot runs at x4 electrical)
• 65W TDP
• Integrated AMD Radeon 740M graphics (RDNA 3, 4 CUs, up to 2.8 GHz) — discrete GPU not required
• ECC memory supported (requires compatible motherboard)
• AMD EXPO & Ryzen Master supported
• Multiplier locked — CPU frequency overclocking not available
• No NPU — AI workload acceleration not available on this model
• Compatible with X870, X870E, X670, X670E, B650, B650E, and A620 motherboards

Proudly sold by the Ringwood Digital Store.