The B860M Eagle Plus WiFi6E is Gigabyte’s mid-range Intel B860 Micro-ATX offering for the LGA1851 platform, stepping above the DS3H WiFi6E with a stronger 8+1+2 digital VRM, VRM Thermal Armor Advanced heatsink, M.2 EZ-Latch Plus and EZ-Latch Click screwless heatsink design on both M.2 connectors, and PCIe EZ-Latch Plus for tool-free GPU removal. The RL-ILM (Robust Latch ILM) CPU socket retention mechanism provides additional CPU contact reliability and simplifies mounting, and the WIFI EZ-Plug design makes antenna installation simpler than traditional threaded SMA connectors. The D5 Bionic Corsa memory subsystem and DDR5 XMP Booster BIOS feature maximise DDR5 performance out of the box, and AI Perfdrive provides automated BIOS optimisation profiles for Core Ultra Series 2 processors. The dual DisplayPort plus HDMI triple-display rear output is a standout feature for a Micro-ATX board at this tier, making it well-suited for multi-monitor office or productivity builds on Core Ultra processors with integrated graphics.

The Intel B860 chipset does not support CPU overclocking. Memory overclocking via Intel XMP profiles is supported. For CPU OC, an Intel Z890 motherboard is required.

The Intel NPU driver (for AI acceleration) is only supported on Windows 11. Windows 10 is supported for general operation but does not benefit from NPU or AI features.

Memory and Storage

Four DDR5 DIMM slots support dual-channel operation up to 256 GB, with XMP profiles reaching DDR5-9066 (OC) in optimal configurations. ECC Un-buffered DIMM modules are supported in non-ECC mode. M2A_CPU is CPU-connected at PCIe 5.0 x4 (128 Gb/s), covered by M.2 Thermal Guard with EZ-Latch Plus retention and EZ-Latch Click screwless heatsink removal. M2P_SB is chipset-connected at PCIe 4.0 x4 (64 Gb/s), also covered by M.2 Thermal Guard. Four SATA 6Gb/s ports handle additional storage, with RAID 0/1/5/10 supported.

Only two M.2 slots are present. Three-drive NVMe builds will need SATA for the additional drive.

Connectivity and I/O

The rear panel provides two DisplayPort 2.1 outputs and one HDMI 2.1 for triple simultaneous display with an Intel iGPU-equipped processor, alongside two USB Gen2 Type-A (10 Gbps, red), two USB Gen1 Type-A (5 Gbps), two USB 2.0 Type-A, a PS/2 keyboard/mouse combo port, and Q-Flash Plus button. Realtek 2.5GbE handles wired networking. Wi-Fi 6E (802.11ax, 2.4/5/6 GHz, 160 MHz) and Bluetooth 5.3 are onboard with WIFI EZ-Plug antenna connectors. A front panel USB Gen2 Type-C header (10 Gbps) and a Gen1 header (2 ports) cover modern case panels, alongside two USB 2.0 headers (4 ports). Fan headers total three — CPU fan, CPU fan/pump, and one system fan — all 4-pin with Smart Fan 6 dual fan curve mode.

Only three fan headers are present. Builds with multiple chassis fans will need a fan splitter or hub.

Integrated display output (dual DisplayPort + HDMI) requires an Intel Core Ultra Series 2 processor with integrated Intel graphics. Core Ultra Series 2 HX processors without iGPU require a discrete GPU.

Key Highlights

• Intel B860 Express Chipset, Socket LGA1851
• Supports Intel Core Ultra Series 2 processors — no CPU overclocking
• Micro-ATX form factor — 6-layer, mid-loss PCB, premium chokes and capacitors
• 8+1+2 phase digital VRM, VRM Thermal Armor Advanced (5 W/mk thermal pad)
• RL-ILM CPU socket retention mechanism
• Single 8-pin ATX12V CPU power connector (UD Solid Pin)
• 4× DDR5 DIMM slots, dual-channel, up to 256 GB, DDR5-9066 (OC)
• XMP memory profile support, ECC UDIMM supported (non-ECC mode)
• D5 Bionic Corsa, DDR5 XMP Booster BIOS feature
• 1× M.2 PCIe 5.0 x4 (CPU, 128 Gb/s, M.2 Thermal Guard, EZ-Latch Plus + EZ-Latch Click) — M2A_CPU
• 1× M.2 PCIe 4.0 x4 (chipset, 64 Gb/s, M.2 Thermal Guard) — M2P_SB
• 4× SATA 6Gb/s ports — RAID 0/1/5/10
• 1× PCIe 5.0 x16 (primary GPU, PCIe UD Slot, EZ-Latch Plus) + 2× PCIe 4.0 x1 (chipset)
• 2× DisplayPort 2.1 + 1× HDMI 2.1 — triple display rear (iGPU only)
• Realtek 2.5GbE LAN
• Wi-Fi 6E (802.11ax, 2.4/5/6 GHz, 160 MHz) + Bluetooth 5.3 — WIFI EZ-Plug
• Rear USB: 2× Gen2 Type-A (10 Gbps) + 2× Gen1 Type-A (5 Gbps) + 2× USB 2.0
• PS/2 keyboard/mouse combo port — rear
• Front USB Gen2 Type-C header (10 Gbps) + Gen1 header (2 ports) + 2× USB 2.0 headers (4 ports)
• 1× CPU fan + 1× CPU fan/pump + 1× system fan headers — Smart Fan 6, dual fan curve mode
• 3× Addressable Gen2 (ARGB) headers + 1× RGB LED header — RGB Fusion 2.0
• Debug boot LEDs (CPU/DRAM/VGA/BOOT)
• M.2 EZ-Latch Plus + EZ-Latch Click (screwless M.2 heatsink)
• PCIe EZ-Latch Plus (tool-free GPU removal)
• AI Perfdrive — automated BIOS optimisation for Core Ultra Series 2
• Q-Flash Plus (BIOS update without CPU/RAM)
• SPI TPM header (GC-TPM2.0 SPI V2 compatible)
• Realtek ALC HD Audio, high-end audio capacitors, S/PDIF out

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The Dell EC24250 is designed around accessibility and aesthetics as much as performance. At its core is the Intel Core i5-1334U — a 13th Gen 10-core (2P+8E), 12-thread Raptor Lake U-series processor running up to 4.6GHz with 12MB cache, paired with 16GB DDR5 RAM and a 512GB M.2 NVMe SSD. Intel UHD Graphics handles integrated display output. It’s a power-efficient, quiet-running configuration well-suited to sustained office and home-office productivity workloads. The Pearl White finish and fabric speaker grille give it a distinctly premium, consumer-friendly aesthetic that stands out against the grey and black competition.

FHD Display & Eye Comfort

The 23.8-inch FHD (1920×1080) IPS InfinityEdge narrow-border display covers 99% sRGB with a 50% higher contrast ratio over the previous generation. Dell ComfortView Plus reduces harmful blue light emissions at the hardware level for comfortable all-day use, and the display runs at a higher refresh rate than the previous generation for a smoother visual experience. Tilt adjusts from 0° to 20° to suit your desk height and viewing angle.

Dolby Atmos Dual Bluetooth Speakers

The EC24250’s built-in dual speaker system with fabric grille carries Dolby Atmos spatial audio certification — and like the Inspiron 5430, the speakers double as a standalone Bluetooth device. You can pair your phone directly to the AiO’s speaker and use it as a room speaker even when the PC is off. This is a genuine differentiator for home office and shared workspaces that doubles as a media or audio environment.

5MP+IR HDR Pop-Up Camera

The 5MP IR camera features HDR technology for clear, balanced imaging even in high-contrast or low-light environments. It tilts from 0° to 20° to frame the shot correctly from any desk setup, and pops up when needed — sitting flush with the display bezel when not in use for a clean look and natural privacy.

Connectivity & Ports

The rear I/O provides USB 3.2 Gen 2 Type-C (below display), HDMI-in 1.4, HDMI-out, 4× USB 3.2 Type-A (rear), and Gigabit Ethernet. A side/front-accessible USB-C port and an SD card reader round out the connectivity. Wireless is Wi-Fi 6E (802.11ax tri-band) and Bluetooth 5.2, and the Dell Pro Wireless Keyboard and Mouse (KM5221W, White) are included.

Stand & Deployment

The innovative triangle stand includes a keyboard shelf underneath the display — keeping the desk surface clean and cable management tidy. Windows 11 Pro 64-bit ships out of the box, and the S suffix in the SKU confirms this unit ships with a 3-year Dell onsite service warranty — a meaningful differentiator for business deployment over consumer-tier support.

Note: The i5-1334U is a U-series mobile processor — efficient and ideal for quiet sustained workloads, but not an H-series chip. This is the right unit for light-to-medium productivity use, not sustained heavy compute. The display is non-touch. This model ships with 16GB DDR5 — confirm RAM configuration (single vs dual channel) with your supplier if integrated graphics throughput matters for your use case. The Bluetooth speaker mode is a consumer-oriented feature; while useful, this is primarily a business-class deployment unit.

Key Highlights

• 23.8″ FHD (1920×1080) IPS InfinityEdge display, 99% sRGB, Dell ComfortView Plus, non-touch
• Intel Core i5-1334U, up to 4.6GHz, 10 cores / 12 threads, 13th Gen
• 16GB DDR5 RAM
• 512GB M.2 NVMe SSD
• 5MP+IR HDR pop-up camera (0–20° tilt), Windows Hello, facial recognition
• Dolby Atmos dual Bluetooth speakers with fabric grille + standalone BT speaker mode
• Keyboard shelf triangle stand
• HDMI-in 1.4 + HDMI-out, USB-C 3.2 Gen 2, 4× USB 3.2 Type-A, SD card reader, Gigabit LAN
• Wi-Fi 6E (802.11ax) + Bluetooth 5.2
• Dell ComfortView Plus, TPM 2.0
• Pearl White finish, Windows 11 Pro 64-bit
• Dell Pro Wireless Keyboard & Mouse (White) included
• 3-year Dell onsite service warranty

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The OptiPlex 7410 Plus is the high-performance variant of the 7410 AiO range, distinguished by its 65W desktop-class processor rather than the 35W T-series chip in the standard 7410. At its heart is the Intel Core i7-13700 vPro — a 16-core (8P+8E), 24-thread Raptor Lake processor running at 2.1GHz base with Turbo Boost Max up to 5.1GHz, 30MB cache, and Intel vPro Enterprise platform support. Paired with 16GB DDR5-4800MHz RAM and a 512GB M.2 PCIe NVMe SSD, this is a genuine high-performance business workstation in an AiO chassis — capable of sustained compute-intensive workloads that would tax the efficiency-oriented 35W competition. Intel UHD Graphics 770 handles integrated display tasks and supports discrete GPU options where needed.

Display & Eye Comfort

The 23.8-inch FHD (1920×1080) IPS anti-glare panel covers 99% sRGB at 250 nits with Dell ComfortView Plus reducing harmful blue light at the hardware level, backed by TÜV Low Blue Light certification. This is the non-touch variant — clear, sharp, and comfortable for extended sessions without the reflective coating of a touch panel.

5MP IR Pop-Up Webcam & Dell Optimizer

The retractable 5MP IR pop-up webcam delivers high-resolution video conferencing with IR support for Windows Hello face authentication. Dual microphones flank the camera for clean audio pickup. Dell Optimizer uses AI to automatically optimise audio levels, cancel background noise, and adapt network prioritisation for active calls — all running in the background without user configuration. The dual 5W built-in speakers provide solid audio for open-plan conferencing.

Enterprise Port Layout

The OptiPlex 7410 Plus has one of the most comprehensive I/O sets in the AiO category. The rear provides: 1× USB-C 3.2 Gen 2×2 (20Gbps), 1× HDMI-out 2.1 (up to 4K@60Hz), 1× HDMI-in 1.4b, 1× DisplayPort 1.4a (up to 5K@60Hz), 2× USB 3.2 Gen 1 Type-A, 2× USB 2.0, and RJ-45 Gigabit Ethernet. The right side adds 1× USB 3.2 Gen 2 Type-A with PowerShare, and the left provides a global headset jack and SD card 4.0 reader. Wireless is Intel Wi-Fi 6E AX211 (802.11ax tri-band) and Bluetooth 5.2.

vPro Security & Fleet Manageability

Intel vPro Enterprise enables Intel AMT for remote out-of-band management — IT can access, diagnose, and repair systems even when the OS is unresponsive. Dell’s security stack adds firmware TPM 2.0, off-host BIOS verification, Indicators of Attack, Secured Component Verification, and Dell Trusted Update Experience for predictable fleet-wide BIOS and driver deployment. The unit is EPEAT Gold, ENERGY STAR, and TCO certified.

3-Year ProSupport NBD

The SA SKU ships with a 3-year Dell ProSupport with Next Business Day on-site service — Dell’s commercial support tier with direct ProSupport engineer access, hardware telemetry integration, and NBD on-site dispatch. Backed by Dell SA locally.

Note: The 7410 Plus uses a 65W desktop processor — it will run warmer and draw more power than the 35W standard 7410. This is the right trade-off for users who need sustained high-performance computing in an AiO form factor; for quiet, power-efficient deployments the 35W models are more appropriate. This is the non-touch variant. The 16GB DDR5 is a single SO-DIMM — adding a matched second module enables dual-channel for better integrated graphics performance. No optical drive is included.

Key Highlights

• 23.8″ FHD (1920×1080) IPS anti-glare display, 99% sRGB, 250 nits, TÜV Low Blue Light, Dell ComfortView Plus, non-touch
• Intel Core i7-13700 vPro, 2.1GHz (up to 5.1GHz), 16 cores / 24 threads, 65W, 13th Gen
• 16GB DDR5-4800MHz SO-DIMM (upgradeable)
• 512GB M.2 PCIe NVMe SSD
• 5MP IR pop-up webcam, Windows Hello, dual 5W speakers, dual-array mic
• Dell Optimizer AI (noise cancellation, network optimisation, app performance)
• USB-C 3.2 Gen 2×2 (20Gbps), HDMI-out 2.1 (4K@60Hz),
• HDMI-in 1.4b, DisplayPort 1.4a (5K@60Hz)
• USB 3.2 Gen 2 Type-A with PowerShare, SD 4.0 reader, Gigabit LAN
• Intel Wi-Fi 6E AX211 (802.11ax) + Bluetooth 5.2
• Intel vPro Enterprise, TPM 2.0, Secured Component Verification, EPEAT Gold
• Windows 11 Pro 64-bit, Dell Pro Wireless KM5221W
• Keyboard & Mouse included
• 3-year Dell ProSupport NBD on-site warranty

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The B850 Gaming X WiFi6E is a meaningful step above the B850 Gaming WiFi6, addressing its three most notable limitations in one move: upgrading from 1GbE to Realtek 2.5GbE LAN, adding Wi-Fi 6E tri-band support with the 6 GHz band, and significantly improving USB connectivity with a rear Gen2 Type-C (10 Gbps) and a front USB Gen2x2 Type-C header (20 Gbps). The VRM and PCB specification remains the same 6+2+2 digital phase design on a 6-layer, mid-loss PCB with VRM Thermal Armor Advanced — suited to mainstream Ryzen builds and moderate overclocking within its thermal limits. Six fan headers, EZ-Latch Plus on the primary PCIe x16 slot, WIFI EZ-Plug for easy antenna installation, dual BIOS, and Q-Flash Plus all carry over from the broader Gaming series formula, making this the most complete value-positioned B850 ATX build in Gigabyte’s range.

CPU overclocking is supported on B850, but the 6+2+2 VRM is best suited to 65W TDP processors for sustained workloads. 105W CPUs run at stock without issue, but sustained all-core overclocking on high-TDP Ryzen 9 chips is outside the comfort zone of this power stage. The B850 Eagle WiFi6E is the step up for heavier OC use.

Memory and Storage

Four DDR5 DIMM slots support dual-channel operation up to 256 GB, with AMD EXPO and XMP profiles reaching DDR5-8200 (OC). M2A_CPU is CPU-connected and runs at PCIe 5.0 x4 (128 Gb/s) with Ryzen 7000/9000, supporting 22110 and 2280 form factors, with M.2 Thermal Guard heatsink. M2B_CPU is CPU-connected at PCIe 4.0 x4 (64 Gb/s) with Ryzen 7000/9000, supporting 22110 and 2280, and drops to PCIe 4.0 x2 with Ryzen 8000 Phoenix 2. M2C_SB is chipset-connected at PCIe 4.0 x2 (32 Gb/s), supporting 22110 and 2280. All three M.2 slots carry M.2 Thermal Guard heatsinks with 5 W/mk thermal pads. Four SATA 6Gb/s ports handle additional storage, with RAID 0/1/5/10 for NVMe (RAID 5 on Ryzen 9000 only) and RAID 0/1/10 for SATA.

M2A_CPU drops from PCIe 5.0 x4 to PCIe 4.0 x4 with all Ryzen 8000 variants. M2B_CPU drops to PCIe 4.0 x2 with Ryzen 8000 Phoenix 2. Full Gen5 M.2 speeds require Ryzen 7000 or 9000.

M2C_SB (chipset, PCIe 4.0 x2 at 32 Gb/s) is best suited to secondary NVMe storage rather than a primary high-performance drive.

Connectivity and I/O

Rear I/O provides nine USB ports: one USB Type-C Gen2 (10 Gbps, CPU), one USB Gen2 Type-A (10 Gbps, red, CPU), three USB Gen1 Type-A (5 Gbps, chipset — 1 on rear, 2 via front header), and three USB 2.0 (CPU+hub rear). A front panel USB Gen2x2 Type-C header (20 Gbps) and a Gen1 header (2 ports) cover modern case panels, alongside two USB 2.0 headers (4 ports). DisplayPort 1.4 (4K 144Hz) and HDMI 2.1 (4K 60Hz) serve iGPU-equipped processors. Realtek 2.5GbE handles wired networking. Wi-Fi 6E (Realtek RTL8852CE, 802.11ax, 2.4/5/6 GHz, 160 MHz) and Bluetooth 5.3 are onboard with WIFI EZ-Plug antenna connectors. Fan headers total six: CPU_FAN, CPU_OPT/pump, three system fan headers, and one system fan/pump header, all 4-pin PWM/DC with Smart Fan 6 and FAN STOP. RGB Fusion 2.0 is supported via three Addressable Gen2 (ARGB) headers and one standard RGB LED header.

The rear USB-C is Gen2 (10 Gbps) — faster than the Gen1 Type-C found on the B850 Gaming WiFi6 and B850 Eagle WiFi6E rear panels. The front Gen2x2 Type-C header (20 Gbps) is a notable inclusion at this price point, shared only with the higher-tier Eagle Ice and Aorus Elite boards in this range.

No debug LEDs, no Multi-Key button, and no onboard reset button are present. For those features, step up to the B850 Eagle WiFi6E or Eagle Ice.

Integrated display output (HDMI/DisplayPort) requires a Ryzen processor with integrated Radeon graphics. Non-G Ryzen 7000/9000 CPUs require a discrete GPU.

Key Highlights

• AMD B850 chipset, Socket AM5 — CPU overclocking supported
• Supports Ryzen 7000, 8000, and 9000 Series
• ATX form factor — 305 mm × 244 mm
• 6+2+2 phase digital VRM, VRM Thermal Armor Advanced
• 6-layer, mid-loss PCB, premium chokes and capacitors
• 8-pin + 4-pin ATX12V CPU power connectors
• 4× DDR5 DIMM slots, dual-channel, up to 256 GB, DDR5-8200 (OC)
• AMD EXPO and XMP memory profile support
• 1× M.2 PCIe 5.0 x4 (CPU, 128 Gb/s, 22110/2280, Thermal Guard) — M2A_CPU
• 1× M.2 PCIe 4.0 x4 (CPU, 64 Gb/s, 22110/2280, Thermal Guard) — M2B_CPU (x2 with Ryzen 8000 Phoenix 2)
• 1× M.2 PCIe 4.0 x2 (chipset, 32 Gb/s, 22110/2280, Thermal Guard) — M2C_SB
• 4× SATA 6Gb/s ports
• RAID 0/1/5/10 NVMe (RAID 5 on Ryzen 9000 only) / 0/1/10 SATA
• 1× PCIe 5.0 x16 (primary GPU, EZ-Latch Plus — Ryzen 7000/9000) / PCIe 4.0 x8/x4 (Ryzen 8000)
• 2× PCIe 3.0 x1 (chipset)
• DisplayPort 1.4 (4K 144Hz) + HDMI 2.1 (4K 60Hz) — rear (iGPU only)
• Realtek 2.5GbE LAN
• Wi-Fi 6E (Realtek RTL8852CE, 802.11ax, 2.4/5/6 GHz, 160 MHz) + Bluetooth 5.3
• 9× rear USB: Type-C Gen2 (10 Gbps) + Gen2 Type-A (10 Gbps) + 3× Gen1 Type-A (5 Gbps) + 3× USB 2.0
• PS/2 keyboard/mouse combo port — rear
• Front USB Gen2x2 Type-C header (20 Gbps) + Gen1 header (2 ports) + 2× USB 2.0 headers (4 ports)
• 1× CPU fan + 1× CPU fan/pump + 3× system fan + 1× system fan/pump headers — Smart Fan 6, FAN STOP
• 3× Addressable Gen2 (ARGB) headers + 1× RGB LED header — RGB Fusion 2.0
• EZ-Latch Plus on PCIe x16 slot
• WIFI EZ-Plug, directional high-gain antenna
• Dual BIOS + Q-Flash Plus (BIOS update without CPU/RAM)
• SPI TPM header
• Realtek ALC897 HD Audio, high-end audio capacitors
• No debug LEDs, no Multi-Key button, no onboard reset button

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The B650 Aorus Elite AX brings Gigabyte’s AORUS build standards to a B650 ATX platform at a price point that doesn’t compromise where it counts. The Twin 14+2+1 digital VRM uses 70A Smart Power Stage MOSFETs on an 8-layer, 2oz copper PCB — a meaningful upgrade over typical mid-range VRM configurations — with fully covered MOSFET heatsinks, a 6mm mega-heatpipe, and 7 W/mk thermal pads keeping everything cool under sustained CPU loads including overclocking. Dual 8+4-pin ATX12V power connectors (both an 8-pin and a supplementary 4-pin) feed the VRM, and both should be connected when running demanding workloads or applying CPU OC. The integrated I/O shield, tool-free EZ-Latch on both PCIe x16 and M.2 connectors, and bottom-mounted Q-Flash Plus button all contribute to a clean, DIY-friendly build experience.

CPU overclocking is supported on B650. The Twin 14+2+1 70A VRM handles the full Ryzen 7000/9000 lineup including 170W+ processors with good headroom for moderate overclocking. Connect both the 8-pin and 4-pin ATX12V cables for any overclocking workloads.

Memory and Storage

Four DDR5 DIMM slots support dual-channel operation up to 256 GB, with AMD EXPO and XMP OC profiles reaching DDR5-8000 and beyond. All three M.2 slots feature M.2 Thermal Guard heatsinks with EZ-Latch for screwless installation and removal. The first slot (M2A_CPU) is CPU-connected and runs at PCIe 5.0 x4 (128 Gb/s) with Ryzen 7000/9000, accepting up to the extended 25110 form factor in addition to standard 2280 and 2580. The second slot (M2B_CPU) is CPU-connected at PCIe 4.0 x4 (64 Gb/s) and also supports 25110. The third slot (M2C_SB) is chipset-connected at PCIe 4.0 x4 (64 Gb/s), likewise supporting up to 25110. Four SATA 6Gb/s ports provide additional storage, and RAID 0/1/10 is supported for both SATA and NVMe devices.

M2A_CPU runs at PCIe 5.0 x4 with Ryzen 7000 and 9000 but drops to PCIe 4.0 x4 with all Ryzen 8000 variants. Ryzen 8000 Phoenix 2 processors further reduce M2B_CPU bandwidth — confirm CPU-specific M.2 bandwidth from Gigabyte’s PCIe/M.2 table if Ryzen 8000 is the chosen processor.

This is B650 (not B650E). The primary PCIe x16 GPU slot runs at PCIe 4.0 x16 with Ryzen 7000/9000, not PCIe 5.0 x16. Current-generation discrete GPUs are unaffected in real-world performance, but this is worth noting for future GPU planning.

Connectivity and I/O

Rear USB is one of the strongest aspects of this board: twelve ports total, comprising a USB 3.2 Gen2 Type-C (10 Gbps, also supporting DisplayPort alt-mode), two USB 3.2 Gen2 Type-A (10 Gbps, red — one of which is the Q-Flash Plus port), five USB 3.2 Gen1 Type-A (5 Gbps), and four USB 2.0 Type-A. A front panel USB 3.2 Gen2x2 Type-C header (20 Gbps) is also provided for modern case panels. Display outputs cover HDMI 2.1 and DisplayPort 1.4 for iGPU-equipped processors. Realtek 2.5GbE handles wired networking with LANGuard protection, while Wi-Fi 6E (802.11ax, 2.4/5/6 GHz, MU-MIMO) and Bluetooth 5.3 cover wireless. Fan headers are comprehensive: CPU_FAN, CPU_OPT, four system fan/pump headers (SYS_FAN1–3 plus SYS_FAN4_PUMP), all 4-pin with PWM/DC support and Smart Fan 6 control. RGB is well covered with two D_LED addressable headers and two LED_C standard RGB headers, all controlled through RGB Fusion 2.0.

No USB 3.2 Gen2x2 Type-C port is present on the rear panel — the Gen2x2 (20 Gbps) connection is front-panel header only. The rear Type-C is Gen2 at 10 Gbps.

Integrated display output (HDMI/DisplayPort) requires a Ryzen processor with integrated Radeon graphics. Non-G Ryzen 7000/9000 CPUs require a discrete GPU.

Key Highlights

• AMD B650 chipset, Socket AM5 — CPU overclocking supported
• Supports Ryzen 7000, 8000, and 9000 Series
• ATX form factor
• Twin 14+2+1 phase digital VRM, 70A Smart Power Stage
• 8-layer, 2oz copper PCB with low-loss design
• Dual 8+4-pin ATX12V CPU power connectors
• 4× DDR5 DIMM slots, dual-channel, up to 256 GB, DDR5-8000+ (OC)
• AMD EXPO and XMP memory profile support
• 1× M.2 PCIe 5.0 x4 (CPU, 128 Gb/s, up to 25110, with Thermal Guard + EZ-Latch) — M2A_CPU
• 1× M.2 PCIe 4.0 x4 (CPU, 64 Gb/s, up to 25110, with Thermal Guard + EZ-Latch) — M2B_CPU
• 1× M.2 PCIe 4.0 x4 (chipset, 64 Gb/s, up to 25110, with Thermal Guard + EZ-Latch) — M2C_SB
• 4× SATA 6Gb/s ports
• RAID 0/1/10 for SATA and NVMe
• 1× PCIe 4.0 x16 (primary GPU, EZ-Latch, stainless steel reinforced) + 2× PCIe 3.0 x1
• HDMI 2.1 + DisplayPort 1.4 — rear (iGPU only)
• Realtek 2.5GbE LANGuard
• Wi-Fi 6E (802.11ax, 2.4/5/6 GHz, MU-MIMO) + Bluetooth 5.3
• 12× rear USB: Gen2 Type-C (10 Gbps) + 2× Gen2 Type-A (10 Gbps) + 5× Gen1 Type-A (5 Gbps) + 4× USB 2.0
• Front USB 3.2 Gen2x2 Type-C header (20 Gbps)
• CPU_FAN + CPU_OPT + 4× system/pump fan headers — Smart Fan 6, all 4-pin PWM/DC
• 2× D_LED (ARGB) headers + 2× LED_C (RGB) headers — RGB Fusion 2.0
• Integrated pre-mounted I/O shield
• EZ-Latch Plus on PCIe x16 and all three M.2 slots
• Q-Flash Plus (BIOS update without CPU/RAM)
• SPI TPM header
• Realtek ALC897 HD Audio CODEC, audio noise guard, high-end audio capacitors

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The Prime B840M-A WiFi brings the same ASUS Prime DNA found on the ATX B840-Plus WiFi into a 244 mm × 244 mm Micro-ATX form factor, making it a strong option for compact builds where ATX clearance isn’t available but no meaningful compromise on feature set is wanted. The 8+2+1 phase power design with discrete MOSFETs and DIGI+ VRM provides stable, efficient power delivery for the full Ryzen 7000/8000/9000 lineup up to 170W TDP. A single 8-pin ATX12V connector handles CPU power — clean, simple, and compatible with virtually any modern PSU. The VRM heatsink, SafeSlot reinforced primary PCIe slot, stainless steel I/O panel, premium audio capacitors with dedicated PCB layers, and audio shielding all carry over from the ATX sibling without compromise.

The B840 chipset does not support CPU overclocking. Memory overclocking via AMD EXPO and ASUS AEMP profiles is supported up to DDR5-7600+ (OC). If CPU OC headroom is a requirement, B850 is the next step up.

The 8+2+1 discrete MOSFET VRM is best matched to 65–105W TDP processors for sustained workloads. 170W-rated CPUs are supported at stock but represent the upper comfort boundary for this power stage.

Memory and Storage

Four DDR5 DIMM slots support dual-channel operation up to 256 GB with AMD EXPO and ASUS AEMP profile support, reaching DDR5-7600+ (OC). Storage across three M.2 slots is well distributed: M2_1 is CPU-connected at PCIe 4.0 x4 (64 Gb/s) in 2280 form factor, M2_2 is also CPU-connected at PCIe 4.0 x4 (64 Gb/s) and notably supports shorter 2242 and 2260 drives in addition to 2280 — useful for smaller drives or repurposed laptop SSDs. M2_3 is chipset-connected at PCIe 3.0 x4 (32 Gb/s) and supports standard 2280 only. All three slots include M.2 heatsink coverage. Four SATA 6Gb/s ports are available for traditional drives, and RAID support follows the same CPU-generation-dependent pattern as the B840-Plus: RAID 0/1/5/10 on Ryzen 9000, RAID 0/1/10 on Ryzen 7000, and RAID 0/1 only on Ryzen 8000.

M2_2 drops from PCIe 4.0 x4 to x2 with Ryzen 8000 Phoenix 2 processors. Ryzen 7000 and 9000 CPUs run both CPU-connected M.2 slots at the full PCIe 4.0 x4 rate.

No PCIe Gen5 M.2 slot is present — the fastest M.2 tier is PCIe 4.0 x4 (64 Gb/s). If Gen5 NVMe is a priority, a B850 or X870 board is required.

Connectivity and I/O

The rear I/O panel offers a notably strong display output for a Micro-ATX board at this tier: dual DisplayPort 1.4 (up to 8K 30Hz each) plus HDMI 2.1 (4K 60Hz) covers triple-display iGPU setups for Ryzen 8000 G-series builds. Rear USB consists of two USB 10 Gbps Type-A and four USB 2.0 Type-A ports, with a USB 5 Gbps Type-C port also on the rear — seven rear ports total. Front panel USB is well covered with a USB 5 Gbps Type-C header plus a standard USB 5 Gbps header supporting two additional ports. Wi-Fi 6E (802.11ax, 2.4/5/6 GHz, 2×2 MU-MIMO) and Bluetooth 5.3 are onboard, with Realtek 2.5G LANGuard Ethernet for wired connectivity. Fan headers include one CPU fan, one CPU OPT, one AIO pump, and three chassis fan headers. Three Addressable Gen 2 (ARGB) headers provide Aura Sync lighting control. Additional internal headers include S/PDIF out, COM port, SPI TPM, and a Clear CMOS header.

The primary PCIe 4.0 x16 GPU slot drops to x8/x4 mode with Ryzen 8000 Series processors. The two chipset-side PCIe 3.0 x16 slots run at x1 mode only — suitable for network cards, capture cards, and similar low-bandwidth add-ins, not additional GPUs.

Integrated display output (HDMI and DisplayPort) requires a Ryzen processor with integrated Radeon graphics. Non-G Ryzen 7000/9000 CPUs do not include an iGPU — a discrete GPU is required in those builds.

Key Highlights

• AMD B840 chipset, Socket AM5
• Supports Ryzen 7000, 8000, and 9000 Series, up to 170W TDP
• Micro-ATX form factor — 244 mm × 244 mm
• 8+2+1 phase power design, discrete MOSFETs, DIGI+ VRM
• Single 8-pin ATX12V CPU power connector
• 4× DDR5 DIMM slots, dual-channel, up to 256 GB, DDR5 7600+ (OC)
• AMD EXPO and ASUS AEMP memory profile support
• 1× M.2 PCIe 4.0 x4 (CPU, 64 Gb/s, 2280) — M2_1, with heatsink
• 1× M.2 PCIe 4.0 x4 (CPU, 64 Gb/s, 2242/2260/2280) — M2_2, with heatsink
• 1× M.2 PCIe 3.0 x4 (chipset, 32 Gb/s, 2280) — M2_3, with heatsink
• 4× SATA 6Gb/s ports
• RAID 0/1/5/10 (Ryzen 9000) / 0/1/10 (Ryzen 7000) / 0/1 (Ryzen 8000)
• 1× PCIe 4.0 x16 (primary GPU, SafeSlot Core+) + 2× PCIe 3.0 x16 (x1 mode, chipset)
• Dual DisplayPort 1.4 (up to 8K 30Hz each) + HDMI 2.1 (4K 60Hz) — rear
• Realtek 2.5G Ethernet with ASUS LANGuard
• Wi-Fi 6E (802.11ax, 2.4/5/6 GHz, 2×2 MU-MIMO) + Bluetooth 5.3
• 2× rear USB 10 Gbps Type-A + 1× rear USB 5 Gbps Type-C + 4× USB 2.0 Type-A
• Front USB 5 Gbps Type-C header + 5 Gbps header (2 ports)
• 1× CPU fan + 1× CPU OPT + 1× AIO pump + 3× chassis fan headers
• 3× Addressable Gen 2 (ARGB) headers — Aura Sync compatible
• S/PDIF out header, SPI TPM header, COM port header
• BIOS FlashBack button (no CPU/RAM required)
• ASUS Q-LED Core debug LEDs (CPU/DRAM/VGA/BOOT)
• ASUS 5X Protection III (overvoltage protection, SafeSlot Core+, stainless steel I/O)
• No PCIe Gen5 M.2 — top M.2 speed is PCIe 4.0 x4

Proudly sold by the Ringwood Digital Store.

The B650M Aorus Elite AX Ice delivers the same Twin 12+2+2 phase 60A Dr.MOS VRM, PCIe 5.0 M.2 storage, and AORUS ELITE wireless connectivity as the standard B650M Aorus Elite AX, wrapped in an all-white PCB with matching white heatsinks and I/O shroud designed for snow-white chassis builds. The platform is electrically identical to its non-Ice sibling — same 6-layer, 2oz copper PCB, VRM Thermal Armor with 6mm heatpipe, M.2 Thermal Guard heatsinks, EZ-Latch Plus on both M.2 connectors, and EZ-Latch on the PCIe x16 slot. The S/PDIF out header and additional CPU cooler LED strip header are notable inclusions that the standard AX variant lacks, and the Realtek ALC1220 audio CODEC is a step up from the ALC897 found on the non-Ice board — delivering meaningfully higher SNR and audio fidelity for users who care about onboard audio.

CPU overclocking is supported on B650. The Twin 12+2+2 60A Dr.MOS stage handles the full Ryzen range at stock with good moderate OC headroom. Connect the 8-pin ATX12V before applying any overclock.

The Wi-Fi module varies by PCB revision: rev 1.0 uses a Realtek RTL8852CE (Wi-Fi 6E, BT 5.3), and rev 1.1 uses an Intel AX210 (Wi-Fi 6E, BT 5.3). Both revisions support 2.4/5/6 GHz and 160 MHz channel width.

Memory and Storage

Four DDR5 DIMM slots support dual-channel operation up to 256 GB, with AMD EXPO and XMP profiles reaching DDR5-8000 (OC) and beyond. M2A_CPU is CPU-connected and runs at PCIe 5.0 x4 (128 Gb/s) with Ryzen 7000/9000, supporting up to the extended 25110 form factor alongside 2580, 22110, and 2280. M2B_CPU is CPU-connected at PCIe 4.0 x4 (64 Gb/s) with Ryzen 7000/9000, also supporting up to 25110. Both slots carry white M.2 Thermal Guard heatsinks and use EZ-Latch Plus for fully screwless installation. Four SATA 6Gb/s ports handle additional storage, with RAID 0/1/10 supported for both SATA and NVMe.

M2A_CPU drops from PCIe 5.0 x4 to PCIe 4.0 x4 with all Ryzen 8000 variants. M2B_CPU drops to PCIe 4.0 x2 with Ryzen 8000 Phoenix 2 processors. Confirm CPU-specific M.2 bandwidth from Gigabyte’s compatibility table for Ryzen 8000 builds.

Only two M.2 slots are present. Builds needing three NVMe drives will need to use SATA for the additional drive.

Connectivity and I/O

Rear USB is well stocked: one USB 3.2 Gen2 Type-C (10 Gbps), two USB 3.2 Gen2 Type-A (10 Gbps, red), four USB 3.2 Gen1 Type-A (5 Gbps) via chipset hub, one further USB 3.2 Gen1 Type-A (5 Gbps) from the chipset, and four USB 2.0 ports — twelve rear USB ports in total. A front panel USB 3.2 Gen2x2 Type-C header (20 Gbps) covers modern cases, alongside a Gen1 header for two further Type-A front ports. DisplayPort 1.4 (4K 144Hz) and HDMI 2.1 (4K 60Hz) serve iGPU-equipped processors. Wi-Fi 6E (802.11ax, 2.4/5/6 GHz, 160 MHz) and Bluetooth 5.3 are onboard alongside Realtek 2.5GbE LAN. Fan headers consist of one CPU fan, one CPU fan/pump, three system fan headers, and one system fan/pump header — six total with Smart Fan 6 control. RGB is handled via two Addressable Gen2 (ARGB) headers, two standard RGB LED headers, and one dedicated CPU cooler LED strip/RGB header, all managed through RGB Fusion 2.0.

Three system fan headers are present rather than the four found on the standard B650M Aorus Elite AX. In chassis with four or more fan positions, a splitter will be needed for full fan header coverage.

No Multi-Key button is present on this board — the Direct to BIOS, Safe Mode, and RGB Switch shortcuts available on the standard B650M Aorus Elite AX are not included on the ICE variant.

Integrated display output (HDMI/DisplayPort) requires a Ryzen processor with integrated Radeon graphics. Non-G Ryzen 7000/9000 CPUs require a discrete GPU.

Key Highlights

• AMD B650 chipset, Socket AM5 — CPU overclocking supported
• Supports Ryzen 7000, 8000, and 9000 Series
• Micro-ATX form factor — all-white PCB and heatsink finish
• Twin 12+2+2 phase 60A Dr.MOS VRM (6+6 parallel phase design)
• 6-layer, 2oz copper PCB
• White VRM Thermal Armor with 6mm heatpipe and integrated I/O shield
• Single 8-pin ATX12V CPU power connector
• 4× DDR5 DIMM slots, dual-channel, up to 256 GB, DDR5-8000+ (OC)
• AMD EXPO and XMP memory profile support
• 1× M.2 PCIe 5.0 x4 (CPU, 128 Gb/s, up to 25110, white EZ-Latch Plus + Thermal Guard) — M2A_CPU
• 1× M.2 PCIe 4.0 x4 (CPU, 64 Gb/s, up to 25110, white EZ-Latch Plus + Thermal Guard) — M2B_CPU
• 4× SATA 6Gb/s ports
• RAID 0/1/10 for SATA and NVMe
• 1× PCIe 4.0 x16 (EZ-Latch) + 1× PCIe 4.0 x4 (chipset)
• DisplayPort 1.4 (4K 144Hz) + HDMI 2.1 (4K 60Hz) — rear (iGPU only)
• Realtek 2.5GbE LAN
• Wi-Fi 6E (802.11ax, 2.4/5/6 GHz, 160 MHz) + Bluetooth 5.3
• 12× rear USB: Gen2 Type-C (10 Gbps) + 2× Gen2 Type-A (10 Gbps) + 5× Gen1 Type-A (5 Gbps) + 4× USB 2.0
• Front USB 3.2 Gen2x2 Type-C header (20 Gbps) + Gen1 header (2 ports)
• 1× CPU fan + 1× CPU fan/pump + 3× system fan + 1× system fan/pump headers — Smart Fan 6
• 2× Addressable Gen2 (ARGB) headers + 2× RGB LED headers + 1× CPU cooler LED/RGB header — RGB Fusion 2.0
• Realtek ALC1220 HD Audio (step up from ALC897), audiophile-grade capacitors, S/PDIF out header
• EZ-Latch Plus on both M.2 slots + EZ-Latch on PCIe x16
• Q-Flash Plus (BIOS update without CPU/RAM)
• SPI TPM header
• No Multi-Key button

Proudly sold by the Ringwood Digital Store.

The B850M Gaming X WiFi6E positions itself clearly above the B850M Eagle WiFi6E with two meaningful improvements: a 5+5 parallel phase VRM (10 effective phases) on a 6-layer, 2oz copper PCB, and a Gen2 USB upgrade across the board — rear Type-C moves from Gen1 to Gen2 (10 Gbps), the rear Gen2 Type-A is retained, and the front panel USB-C header steps up from Gen1 to Gen2 (10 Gbps). Everything else from the Eagle WiFi6E carries through: Wi-Fi 6E (Realtek RTL8852CE, 2.4/5/6 GHz, 160 MHz) + Bluetooth 5.3, Realtek 2.5GbE LAN, PCIe Gen5 M.2 storage up to 25110 form factor, dual DisplayPort 1.4 plus HDMI 2.1 triple-display output, PCIe 5.0 x16 GPU slot, onboard reset button, debug LEDs, and three ARGB headers. For builders who want a well-connected B850 Micro-ATX wireless board with a VRM that handles moderate overclocking confidently, the Gaming X WiFi6E is the more complete package.

CPU overclocking is supported on B850. The 5+5 parallel phase VRM on the 2oz copper PCB handles the full mainstream Ryzen 7000/9000 range at stock and moderate OC confidently — a step up from the Eagle WiFi6E. Sustained heavy all-core overclocking on 170W Ryzen 9 chips is still better served by the B850M Aorus Elite AX.

Memory and Storage

Four DDR5 DIMM slots support dual-channel operation up to 256 GB, with AMD EXPO and XMP profiles reaching DDR5-8200 (OC). M2A_CPU is CPU-connected at PCIe 5.0 x4 (128 Gb/s) with Ryzen 7000/9000, supporting up to 25110, 22110, 2580, and 2280 form factors, with 5 W/mk thermal pad coverage. M2B_CPU is CPU-connected at PCIe 4.0 x4 (64 Gb/s) with Ryzen 7000/9000, supporting 22110 and 2280, and drops to PCIe 4.0 x2 with Ryzen 8000 Phoenix 2. Four SATA 6Gb/s ports handle additional storage, with RAID 0/1/5/10 for NVMe (RAID 5 on Ryzen 9000 only) and RAID 0/1/10 for SATA.

Only two M.2 slots are present — no chipset-connected third M.2 slot. Three-drive NVMe builds will need SATA for the additional drive.

M2A_CPU drops from PCIe 5.0 x4 to PCIe 4.0 x4 with all Ryzen 8000 variants. M2B_CPU drops to PCIe 4.0 x2 with Ryzen 8000 Phoenix 2. Full Gen5 speeds require Ryzen 7000 or 9000.

No dedicated M.2 heatsink covers are included — only 5 W/mk thermal pads. An aftermarket M.2 heatsink is advisable for sustained heavy NVMe workloads on M2A_CPU.

Connectivity and I/O

Rear I/O provides nine USB ports: one USB Type-C Gen2 (10 Gbps, CPU), one USB Gen2 Type-A (10 Gbps, red, CPU), two USB Gen1 Type-A (5 Gbps, chipset), and four USB 2.0 Type-A (CPU+hub), alongside dual DisplayPort 1.4 (4K 144Hz each), HDMI 2.1 (4K 60Hz), a PS/2 keyboard/mouse combo port, and Q-Flash Plus button. Front panel connectivity includes a USB Type-C Gen2 header (10 Gbps, chipset), a Gen1 header (2 ports), and two USB 2.0 headers (4 ports). Wi-Fi 6E (Realtek RTL8852CE, 802.11ax, 2.4/5/6 GHz, 160 MHz) and Bluetooth 5.3 are onboard alongside Realtek 2.5GbE LAN. Fan headers total four: CPU_FAN, CPU_OPT/pump, one system fan, and one system fan/pump, all 4-pin PWM/DC with Smart Fan 6 and FAN STOP. RGB Fusion 2.0 is supported via three Addressable Gen2 (ARGB) headers and one standard RGB LED header. An onboard reset button and debug boot LEDs complete the feature set.

Only four fan headers are present. Builds with more than two chassis fans will need a fan splitter or hub.

Integrated display output (dual DisplayPort + HDMI) requires a Ryzen processor with integrated Radeon graphics. Non-G Ryzen 7000/9000 CPUs require a discrete GPU.

Key Highlights

• AMD B850 chipset, Socket AM5 — CPU overclocking supported
• Supports Ryzen 7000, 8000, and 9000 Series
• Micro-ATX form factor
• 5+5 parallel phase VRM (10 effective phases)
• 6-layer, 2oz copper PCB, premium chokes and capacitors
• Single 8-pin ATX12V CPU power connector
• 4× DDR5 DIMM slots, dual-channel, up to 256 GB, DDR5-8200 (OC)
• AMD EXPO and XMP memory profile support
• 1× M.2 PCIe 5.0 x4 (CPU, 128 Gb/s, up to 25110/22110/2580/2280, 5 W/mk thermal pad) — M2A_CPU
• 1× M.2 PCIe 4.0 x4 (CPU, 64 Gb/s, 22110/2280, 5 W/mk thermal pad) — M2B_CPU (x2 with Ryzen 8000 Phoenix 2)
• No chipset M.2 slot — two M.2 slots only
• 4× SATA 6Gb/s ports
• RAID 0/1/5/10 NVMe (RAID 5 on Ryzen 9000 only) / 0/1/10 SATA
• 1× PCIe 5.0 x16 (primary GPU, PCIe UD Slot — Ryzen 7000/9000) / PCIe 4.0 x8/x4 (Ryzen 8000)
• 1× PCIe 3.0 x4 (chipset)
• Dual DisplayPort 1.4 (4K 144Hz each) + HDMI 2.1 (4K 60Hz) — triple display (iGPU only)
• Realtek 2.5GbE LAN
• Wi-Fi 6E (Realtek RTL8852CE, 802.11ax, 2.4/5/6 GHz, 160 MHz) + Bluetooth 5.3
• 9× rear USB: Type-C Gen2 (10 Gbps) + Gen2 Type-A (10 Gbps) + 2× Gen1 Type-A (5 Gbps) + 4× USB 2.0
• PS/2 keyboard/mouse combo port — rear
• Front USB Type-C Gen2 header (10 Gbps) + Gen1 header (2 ports) + 2× USB 2.0 headers (4 ports)
• 1× CPU fan + 1× CPU fan/pump + 1× system fan + 1× system fan/pump headers — Smart Fan 6, FAN STOP
• 3× Addressable Gen2 (ARGB) headers + 1× RGB LED header — RGB Fusion 2.0
• Onboard reset button
• Debug boot LEDs (CPU/DRAM/VGA/BOOT)
• EZ-Latch on PCIe x16 slot
• X3D Turbo Mode BIOS feature
• Q-Flash Plus (BIOS update without CPU/RAM)
• SPI TPM header
• Realtek ALC897 HD Audio, high-end audio capacitors

Proudly sold by the Ringwood Digital Store.

The B650M Aorus Elite AX is the wireless-equipped variant of the B650M Aorus Elite, adding onboard Wi-Fi 6E and Bluetooth 5.3 to an otherwise identical platform. The Twin 12+2+2 phase 60A Dr.MOS VRM on a 6-layer, 2oz copper PCB with fully covered VRM Thermal Armor and a 6mm heatpipe delivers stable, thermally managed power across the full Ryzen 7000/8000/9000 range with genuine overclocking headroom. EZ-Latch on the PCIe x16 slot and EZ-Latch Plus on both M.2 connectors make graphics card swaps and SSD installation fully screwless, while the Multi-Key onboard button provides one-press access to RGB switch, Direct to BIOS, and Safe Mode — a practical set of shortcuts for both enthusiasts and system builders. Q-Flash Plus rounds out the toolkit, enabling BIOS updates without any CPU or RAM installed.

CPU overclocking is supported on B650. The Twin 12+2+2 60A Dr.MOS stage handles the full Ryzen range including 170W processors at stock and supports moderate CPU OC confidently. Connect the 8-pin ATX12V before applying any overclock.

The Wi-Fi module varies by PCB revision: rev 1.0 uses an AMD RZ616 (Wi-Fi 6E, BT 5.2), rev 1.1 uses an Intel AX210 (Wi-Fi 6E, BT 5.3), and rev 1.2/1.3 uses a Realtek RTL8852CE (Wi-Fi 6E, BT 5.3). All revisions support 2.4/5/6 GHz and 160 MHz channel width. Verify the specific revision in the box if module brand matters for your deployment.

Memory and Storage

Four DDR5 DIMM slots support dual-channel operation up to 256 GB, with AMD EXPO and XMP profiles reaching DDR5-8000 (OC) and beyond. The first M.2 slot (M2A_CPU) is CPU-connected and runs at PCIe 5.0 x4 (128 Gb/s) with Ryzen 7000/9000, supporting up to the extended 25110 form factor. The second slot (M2B_CPU) is CPU-connected at PCIe 4.0 x4 (64 Gb/s), also supporting up to 25110. Both M.2 slots carry M.2 Thermal Guard heatsinks and use EZ-Latch Plus for fully screwless installation. Four SATA 6Gb/s ports handle additional storage, with RAID 0/1/10 supported for both SATA and NVMe.

M2A_CPU drops from PCIe 5.0 x4 to PCIe 4.0 x4 with all Ryzen 8000 variants. With Ryzen 8000 Phoenix 2, M2B_CPU bandwidth may also be reduced — confirm CPU-specific M.2 speeds from Gigabyte’s compatibility table before purchasing a Ryzen 8000 build.

Only two M.2 slots are present. Builds requiring three NVMe drives will need SATA for the additional drive, or should step up to the ATX B650 Aorus Elite AX which carries three M.2 slots.

Connectivity and I/O

Rear I/O delivers a rear USB 3.2 Gen2 Type-C (10 Gbps), two USB 3.2 Gen2 Type-A (10 Gbps, red — one doubling as the Q-Flash Plus port), five USB 3.2 Gen1 Type-A (5 Gbps), and four USB 2.0 ports. A front panel USB 3.2 Gen2x2 Type-C header (20 Gbps) supports modern case panels. DisplayPort 1.4 (4K 144Hz) and HDMI 2.1 (4K 60Hz) are provided for iGPU-equipped processors. Wi-Fi 6E (802.11ax, 2.4/5/6 GHz, 160 MHz) and Bluetooth 5.3 are onboard alongside Realtek 2.5GbE LAN. Fan headers include CPU_FAN, CPU_OPT, and four system fan/pump headers, all 4-pin with Smart Fan 6 PWM/DC control and FAN STOP. RGB Fusion 2.0 is supported via two Addressable Gen2 (ARGB) headers and three standard RGB LED headers.

Integrated display output (HDMI/DisplayPort) requires a Ryzen processor with integrated Radeon graphics. Non-G Ryzen 7000/9000 CPUs require a discrete GPU.

Key Highlights

• AMD B650 chipset, Socket AM5 — CPU overclocking supported
• Supports Ryzen 7000, 8000, and 9000 Series
• Micro-ATX form factor
• Twin 12+2+2 phase 60A Dr.MOS VRM (6+6 parallel phase design)
• 6-layer, 2oz copper PCB
• VRM Thermal Armor with 6mm heatpipe and integrated I/O shield
• Single 8-pin ATX12V CPU power connector (UD Solid Pin)
• 4× DDR5 DIMM slots, dual-channel, up to 256 GB, DDR5-8000+ (OC)
• AMD EXPO and XMP memory profile support
• 1× M.2 PCIe 5.0 x4 (CPU, 128 Gb/s, up to 25110, EZ-Latch Plus + Thermal Guard) — M2A_CPU
• 1× M.2 PCIe 4.0 x4 (CPU, 64 Gb/s, up to 25110, EZ-Latch Plus + Thermal Guard) — M2B_CPU
• 4× SATA 6Gb/s ports
• RAID 0/1/10 for SATA and NVMe
• 1× PCIe 4.0 x16 (EZ-Latch, PCIe UD Slot reinforcement) + 1× PCIe 4.0 x4 (chipset)
• DisplayPort 1.4 (4K 144Hz) + HDMI 2.1 (4K 60Hz) — rear (iGPU only)
• Realtek 2.5GbE LAN
• Wi-Fi 6E (802.11ax, 2.4/5/6 GHz, 160 MHz) + Bluetooth 5.3 (rev 1.1+)
• Rear USB: Gen2 Type-C (10 Gbps) + 2× Gen2 Type-A (10 Gbps) + 5× Gen1 Type-A (5 Gbps) + 4× USB 2.0
• Front USB 3.2 Gen2x2 Type-C header (20 Gbps)
• CPU_FAN + CPU_OPT + 4× system/pump fan headers — Smart Fan 6, FAN STOP
• 2× Addressable Gen2 (ARGB) headers + 3× RGB LED headers — RGB Fusion 2.0
• Multi-Key button (RGB Switch / Direct to BIOS / Safe Mode)
• EZ-Latch Plus on both M.2 slots + EZ-Latch on PCIe x16
• Q-Flash Plus (BIOS update without CPU/RAM)
• SPI TPM header
• Realtek ALC897 HD Audio, audiophile-grade capacitors, audio noise guard

Proudly sold by the Ringwood Digital Store.

The B850M Eagle WiFi6E Ice is electrically identical to the B850M Eagle WiFi6E, delivering the same B850 platform with CPU overclocking support, PCIe Gen5 GPU and M.2 bandwidth, Wi-Fi 6E tri-band wireless, Realtek 2.5GbE LAN, and dual DisplayPort 1.4 plus HDMI 2.1 triple-display output — all in white PCB, white heatsink, and white component styling for snow-white chassis builds. The white M.2 area, white PCIe slot, and integrated white I/O shield keep the aesthetic consistent across the full board surface, making it a complete white Micro-ATX B850 wireless option without compromising on the underlying specification. All the practical build features carry over directly: onboard reset button, three ARGB and one RGB header for white ARGB lighting, debug boot LEDs, WIFI EZ-Plug antenna installation, X3D Turbo Mode BIOS feature, and Q-Flash Plus.

CPU overclocking is supported on B850, but the entry-level VRM on this board is best suited to 65–105W TDP processors for sustained workloads. Sustained heavy all-core OC on 170W Ryzen 9 chips is outside the comfort zone of this power stage. The B850M Aorus Elite AX Ice is the step up for those builds in a white format.

Memory and Storage

Four DDR5 DIMM slots support dual-channel operation up to 256 GB, with AMD EXPO and XMP profiles reaching DDR5-8200 (OC). M2A_CPU is CPU-connected at PCIe 5.0 x4 (128 Gb/s) with Ryzen 7000/9000, supporting up to 25110, 22110, 2580, and 2280 form factors, with 5 W/mk thermal pad coverage. M2B_CPU is CPU-connected at PCIe 4.0 x4 (64 Gb/s) with Ryzen 7000/9000, supporting 22110 and 2280, and drops to PCIe 4.0 x2 with Ryzen 8000 Phoenix 2. Four SATA 6Gb/s ports handle additional storage, with RAID 0/1/5/10 for NVMe (RAID 5 on Ryzen 9000 only) and RAID 0/1/10 for SATA.

Only two M.2 slots are present — no chipset-connected third M.2 slot. Three-drive NVMe builds will need SATA for the additional drive.

M2A_CPU drops from PCIe 5.0 x4 to PCIe 4.0 x4 with all Ryzen 8000 variants. M2B_CPU drops to PCIe 4.0 x2 with Ryzen 8000 Phoenix 2. Full Gen5 speeds require Ryzen 7000 or 9000.

No dedicated M.2 heatsink covers are included — only 5 W/mk thermal pads. An aftermarket M.2 heatsink is advisable for M2A_CPU under sustained heavy NVMe workloads.

Connectivity and I/O

Rear I/O provides nine USB ports: one USB Type-C Gen1 (5 Gbps, CPU), one USB Gen2 Type-A (10 Gbps, red, CPU), two USB Gen1 Type-A (5 Gbps, chipset), and four USB 2.0 Type-A (CPU+hub), alongside dual DisplayPort 1.4 (4K 144Hz each), HDMI 2.1 (4K 60Hz), a PS/2 keyboard/mouse combo port, and Q-Flash Plus button. Front panel connectivity includes a USB Type-C Gen1 header (5 Gbps), a Gen1 header (2 ports), and two USB 2.0 headers (4 ports). Wi-Fi 6E (Realtek RTL8852CE, 802.11ax, 2.4/5/6 GHz, 160 MHz) and Bluetooth 5.3 are onboard with WIFI EZ-Plug antenna connectors, alongside Realtek 2.5GbE LAN. Fan headers total four: CPU_FAN, CPU_OPT/pump, one system fan, and one system fan/pump, all 4-pin PWM/DC with Smart Fan 6 and FAN STOP. RGB Fusion 2.0 is supported via three Addressable Gen2 (ARGB) headers and one standard RGB LED header. An onboard reset button and debug boot LEDs complete the feature set.

The rear USB Type-C is Gen1 (5 Gbps) — if rear Gen2 USB-C is a priority, the B850M DS3H or DS3H Ice offers a Gen2 rear Type-C.

Only four fan headers are present. Builds with more than two chassis fans will need a fan splitter or hub.

Integrated display output (dual DisplayPort + HDMI) requires a Ryzen processor with integrated Radeon graphics. Non-G Ryzen 7000/9000 CPUs require a discrete GPU.

Key Highlights

• AMD B850 chipset, Socket AM5 — CPU overclocking supported
• Supports Ryzen 7000, 8000, and 9000 Series
• Micro-ATX form factor — all-white PCB and heatsink finish
• 6-layer, mid-loss PCB, premium chokes and capacitors
• Single 8-pin ATX12V CPU power connector
• 4× DDR5 DIMM slots, dual-channel, up to 256 GB, DDR5-8200 (OC)
• AMD EXPO and XMP memory profile support
• 1× M.2 PCIe 5.0 x4 (CPU, 128 Gb/s, up to 25110/22110/2580/2280, 5 W/mk thermal pad) — M2A_CPU
• 1× M.2 PCIe 4.0 x4 (CPU, 64 Gb/s, 22110/2280, 5 W/mk thermal pad) — M2B_CPU (x2 with Ryzen 8000 Phoenix 2)
• No chipset M.2 slot — two M.2 slots only
• 4× SATA 6Gb/s ports
• RAID 0/1/5/10 NVMe (RAID 5 on Ryzen 9000 only) / 0/1/10 SATA
• 1× PCIe 5.0 x16 (primary GPU, PCIe UD Slot — Ryzen 7000/9000) / PCIe 4.0 x8/x4 (Ryzen 8000)
• 1× PCIe 3.0 x4 (chipset)
• Dual DisplayPort 1.4 (4K 144Hz each) + HDMI 2.1 (4K 60Hz) — triple display (iGPU only)
• Realtek 2.5GbE LAN
• Wi-Fi 6E (Realtek RTL8852CE, 802.11ax, 2.4/5/6 GHz, 160 MHz) + Bluetooth 5.3
• 9× rear USB: Type-C Gen1 (5 Gbps) + Gen2 Type-A (10 Gbps) + 2× Gen1 Type-A (5 Gbps) + 4× USB 2.0
• PS/2 keyboard/mouse combo port — rear
• Front USB Type-C Gen1 header (5 Gbps) + Gen1 header (2 ports) + 2× USB 2.0 headers (4 ports)
• 1× CPU fan + 1× CPU fan/pump + 1× system fan + 1× system fan/pump headers — Smart Fan 6, FAN STOP
• 3× Addressable Gen2 (ARGB) headers + 1× RGB LED header — RGB Fusion 2.0
• Onboard reset button
• Debug boot LEDs (CPU/DRAM/VGA/BOOT)
• EZ-Latch on PCIe x16 slot
• WIFI EZ-Plug, directional high-gain antenna
• X3D Turbo Mode BIOS feature
• Q-Flash Plus (BIOS update without CPU/RAM)
• SPI TPM header
• Realtek ALC897 HD Audio, high-end audio capacitors

Proudly sold by the Ringwood Digital Store.