Gigabyte B850M Eagle WiFi6E (AMD AM5) Motherboard

R3,495.00 inc. VAT

The Gigabyte B850M Eagle WiFi6E is a Micro-ATX AM5 motherboard built on the AMD B850 chipset, supporting Ryzen 7000, 8000, and 9000 Series processors. It features a 6-layer mid-loss PCB, four DDR5 DIMM slots for up to 256 GB with EXPO/XMP support, a PCIe 5.0 M.2 slot (up to 25110) and a PCIe 4.0 M.2 slot both with 5 W/mk thermal pads, four SATA ports, Realtek 2.5GbE LAN, Wi-Fi 6E with Bluetooth 5.3, dual DisplayPort 1.4 plus HDMI 2.1 for triple-display output, a PCIe 5.0 x16 GPU slot, four fan headers, three ARGB headers, debug LEDs, an onboard reset button, and Q-Flash Plus — a practical B850 Micro-ATX wireless board at an accessible price.

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Description

B850 Micro-ATX with Wi-Fi 6E and PCIe Gen5

The B850M Eagle WiFi6E brings B850’s headline advantages — CPU overclocking, PCIe Gen5 GPU and M.2 bandwidth, and Wi-Fi 6E tri-band wireless — to a Micro-ATX footprint at a price point that doesn’t ask for AORUS-tier extras. The 6-layer, mid-loss PCB with premium chokes and capacitors provides solid power delivery for mainstream Ryzen builds, and the Wi-Fi 6E module (Realtek RTL8852CE, 2.4/5/6 GHz, 160 MHz) alongside Realtek 2.5GbE LAN means the full wired and wireless networking stack is covered out of the box. The dual DisplayPort 1.4 plus HDMI 2.1 triple-display rear output is a standout feature for a Micro-ATX board at this tier, making it well-suited for multi-monitor Ryzen 8000 G-series office or workstation builds. M.2 slots are covered by 5 W/mk thermal pads, the onboard reset button and debug LEDs aid build and diagnostic workflows, and EZ-Latch on the primary PCIe x16 slot handles tool-free GPU removal.

⚠️ CPU overclocking is supported on B850, but the entry-level VRM on this board is best suited to 65–105W TDP processors for sustained workloads. Moderate overclocking on mainstream Ryzen is supported; sustained heavy all-core OC on 170W Ryzen 9 chips is outside the comfort zone of this power stage. The B850M Aorus Elite AX is the step up for heavier OC use.

Memory and Storage

Four DDR5 DIMM slots support dual-channel operation up to 256 GB, with AMD EXPO and XMP profiles reaching DDR5-8200 (OC). M2A_CPU is CPU-connected at PCIe 5.0 x4 (128 Gb/s) with Ryzen 7000/9000, supporting up to 25110, 22110, 2580, and 2280 form factors, with 5 W/mk thermal pad coverage. M2B_CPU is CPU-connected at PCIe 4.0 x4 (64 Gb/s) with Ryzen 7000/9000, supporting 22110 and 2280, and drops to PCIe 4.0 x2 with Ryzen 8000 Phoenix 2. Four SATA 6Gb/s ports handle additional storage, with RAID 0/1/5/10 for NVMe (RAID 5 on Ryzen 9000 only) and RAID 0/1/10 for SATA.

⚠️ Only two M.2 slots are present — no chipset-connected third M.2 slot. Three-drive NVMe builds will need SATA for the additional drive.

⚠️ M2A_CPU drops from PCIe 5.0 x4 to PCIe 4.0 x4 with all Ryzen 8000 variants. M2B_CPU drops to PCIe 4.0 x2 with Ryzen 8000 Phoenix 2. Full Gen5 M.2 speeds require Ryzen 7000 or 9000.

⚠️ No dedicated M.2 heatsink covers are included — only 5 W/mk thermal pads. For sustained heavy NVMe workloads, an aftermarket M.2 heatsink is advisable for M2A_CPU.

Connectivity and I/O

Rear I/O provides nine USB ports: one USB Type-C Gen1 (5 Gbps, CPU), one USB Gen2 Type-A (10 Gbps, red, CPU), two USB Gen1 Type-A (5 Gbps, chipset), and four USB 2.0 Type-A (CPU+hub), alongside dual DisplayPort 1.4 (4K 144Hz each), HDMI 2.1 (4K 60Hz), a PS/2 keyboard/mouse combo port, and Q-Flash Plus button. Front panel connectivity includes a USB Type-C Gen1 header (5 Gbps), a Gen1 header (2 ports), and two USB 2.0 headers (4 ports). Wi-Fi 6E (Realtek RTL8852CE, 802.11ax, 2.4/5/6 GHz, 160 MHz) and Bluetooth 5.3 are onboard with WIFI EZ-Plug antenna connectors, alongside Realtek 2.5GbE LAN. Fan headers total four: CPU_FAN, CPU_OPT/pump, one system fan, and one system fan/pump, all 4-pin PWM/DC with Smart Fan 6 and FAN STOP. RGB Fusion 2.0 is supported via three Addressable Gen2 (ARGB) headers and one standard RGB LED header. An onboard reset button and debug boot LEDs complete the feature set.

⚠️ The rear USB Type-C is Gen1 (5 Gbps), not Gen2 — a step down from the B850M DS3H’s Gen2 Type-C rear port. If rear Gen2 USB-C is important, the DS3H is the better fit.

⚠️ Only four fan headers are present. Builds with more than two chassis fans will need a fan splitter or hub.

⚠️ Integrated display output (dual DisplayPort + HDMI) requires a Ryzen processor with integrated Radeon graphics. Non-G Ryzen 7000/9000 CPUs require a discrete GPU.

Key Highlights

  • AMD B850 chipset, Socket AM5 — CPU overclocking supported
  • Supports Ryzen 7000, 8000, and 9000 Series
  • Micro-ATX form factor
  • 6-layer, mid-loss PCB, premium chokes and capacitors
  • Single 8-pin ATX12V CPU power connector
  • 4× DDR5 DIMM slots, dual-channel, up to 256 GB, DDR5-8200 (OC)
  • AMD EXPO and XMP memory profile support
  • 1× M.2 PCIe 5.0 x4 (CPU, 128 Gb/s, up to 25110/22110/2580/2280, 5 W/mk thermal pad) — M2A_CPU
  • 1× M.2 PCIe 4.0 x4 (CPU, 64 Gb/s, 22110/2280, 5 W/mk thermal pad) — M2B_CPU (x2 with Ryzen 8000 Phoenix 2)
  • No chipset M.2 slot — two M.2 slots only
  • 4× SATA 6Gb/s ports
  • RAID 0/1/5/10 NVMe (RAID 5 on Ryzen 9000 only) / 0/1/10 SATA
  • 1× PCIe 5.0 x16 (primary GPU, PCIe UD Slot — Ryzen 7000/9000) / PCIe 4.0 x8/x4 (Ryzen 8000)
  • 1× PCIe 3.0 x4 (chipset)
  • Dual DisplayPort 1.4 (4K 144Hz each) + HDMI 2.1 (4K 60Hz) — triple display (iGPU only)
  • Realtek 2.5GbE LAN
  • Wi-Fi 6E (Realtek RTL8852CE, 802.11ax, 2.4/5/6 GHz, 160 MHz) + Bluetooth 5.3
  • 9× rear USB: Type-C Gen1 (5 Gbps) + Gen2 Type-A (10 Gbps) + 2× Gen1 Type-A (5 Gbps) + 4× USB 2.0
  • PS/2 keyboard/mouse combo port — rear
  • Front USB Type-C Gen1 header (5 Gbps) + Gen1 header (2 ports) + 2× USB 2.0 headers (4 ports)
  • 1× CPU fan + 1× CPU fan/pump + 1× system fan + 1× system fan/pump headers — Smart Fan 6, FAN STOP
  • 3× Addressable Gen2 (ARGB) headers + 1× RGB LED header — RGB Fusion 2.0
  • Onboard reset button
  • Debug boot LEDs (CPU/DRAM/VGA/BOOT)
  • EZ-Latch on PCIe x16 slot
  • WIFI EZ-Plug, directional high-gain antenna
  • X3D Turbo Mode BIOS feature
  • Q-Flash Plus (BIOS update without CPU/RAM)
  • SPI TPM header
  • Realtek ALC897 HD Audio, high-end audio capacitors

 

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Additional information

Weight 1 kg
Dimensions 24.4 × 24.4 × 1 cm
Model

MB-GB850ME+W

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