Gigabyte B850M DS3H (AMD AM5) Motherboard

R3,125.00 inc. VAT

The Gigabyte B850M DS3H is a Micro-ATX AM5 motherboard built on the AMD B850 chipset, supporting Ryzen 7000, 8000, and 9000 Series processors. It features a 4+4 parallel phase VRM on a 6-layer 2oz copper PCB, four DDR5 DIMM slots for up to 256 GB with EXPO/XMP support, a PCIe 5.0 M.2 slot (up to 25110) and a PCIe 4.0 M.2 slot, four SATA ports, Realtek 2.5GbE LAN, dual DisplayPort 1.4 plus HDMI 2.1 for triple-display output, rear USB Gen2 Type-C and Gen2 Type-A (both 10 Gbps), a front USB Gen2 Type-C header, four fan headers, three ARGB headers, debug LEDs, an onboard reset button, and Q-Flash Plus — a well-rounded B850 Micro-ATX board that meaningfully steps up from the D3HP with better VRM, 2.5GbE, and Gen2 USB.

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Description

Meaningful Upgrades Where It Counts

The B850M DS3H positions itself clearly above the B850M D3HP by correcting the three areas where that board compromises: VRM quality, LAN speed, and USB connectivity. The 4+4 parallel phase design on a 6-layer, 2oz copper PCB with premium chokes and capacitors delivers better sustained power delivery and thermal headroom than entry-level B850 VRMs, making the DS3H more comfortable handling higher-TDP Ryzen builds and moderate CPU overclocking. Realtek 2.5GbE replaces the 1GbE found on the D3HP, and both the rear panel USB Type-C and front panel USB-C header are Gen2 (10 Gbps) — a category improvement over the D3HP’s Gen1 Type-C. The three ARGB headers and onboard reset button are further inclusions that reinforce the DS3H’s stronger feature positioning. Dual DisplayPort 1.4 plus HDMI 2.1 triple-display output, debug LEDs, X3D Turbo Mode BIOS feature, and Q-Flash Plus all carry through from the broader B850M lineup.

⚠️ CPU overclocking is fully supported on B850. The 4+4 parallel VRM on the 2oz copper PCB handles the mainstream Ryzen range at stock with good moderate OC headroom — a step up from the D3HP. Sustained heavy all-core overclocking on 170W Ryzen 9 processors is still better served by the B850M Aorus Elite tier.

Memory and Storage

Four DDR5 DIMM slots support dual-channel operation up to 256 GB, with AMD EXPO and XMP profiles reaching DDR5-8200 (OC). M2A_CPU is CPU-connected at PCIe 5.0 x4 (128 Gb/s) with Ryzen 7000/9000 and supports the extended 25110, 22110, 2580, and 2280 form factors — the widest M.2 form factor coverage in the B850M lineup at this tier. M2B_CPU is CPU-connected at PCIe 4.0 x4 (64 Gb/s) with Ryzen 7000/9000, supporting 22110 and 2280, and drops to PCIe 4.0 x2 with Ryzen 8000 Phoenix 2. Neither M.2 slot includes a dedicated heatsink — thermal pads or aftermarket heatsinks are advisable for sustained NVMe workloads. Four SATA 6Gb/s ports handle additional storage, with RAID 0/1/5/10 for NVMe (RAID 5 on Ryzen 9000 only) and RAID 0/1/10 for SATA.

⚠️ Only two M.2 slots are present — no chipset-connected third M.2 slot. Three-drive NVMe builds will need SATA for the additional drive.

⚠️ M2A_CPU drops from PCIe 5.0 x4 to PCIe 4.0 x4 with Ryzen 8000 Phoenix 1, and M2B_CPU drops to PCIe 4.0 x2 with Ryzen 8000 Phoenix 2. Full Gen5 M.2 speeds require Ryzen 7000 or 9000.

⚠️ No M.2 heatsinks are included. For sustained NVMe workloads, thermal management for M2A_CPU in particular is recommended.

Connectivity and I/O

Rear I/O provides nine USB ports: one USB Type-C Gen2 (10 Gbps, CPU), one USB Gen2 Type-A (10 Gbps, red, CPU), two USB Gen1 Type-A (5 Gbps, chipset), and four USB 2.0 Type-A (CPU+hub), alongside dual DisplayPort 1.4 (4K 144Hz each), HDMI 2.1 (4K 60Hz), a PS/2 keyboard/mouse combo port, and Q-Flash Plus button. Front panel connectivity includes a USB Type-C Gen2 header (10 Gbps), a Gen1 header (2 ports), and two USB 2.0 headers (4 ports). Realtek 2.5GbE handles wired networking. Fan headers total four: CPU_FAN, CPU_OPT/pump, one system fan, and one system fan/pump, all 4-pin PWM/DC with Smart Fan 6 and FAN STOP. RGB Fusion 2.0 is supported via three Addressable Gen2 (ARGB) headers and one standard RGB LED header. An onboard reset button and debug boot LEDs (CPU/DRAM/VGA/BOOT) complete the build-friendly feature set.

⚠️ No onboard Wi-Fi and no M.2 Key E slot for a wireless module. A USB or PCIe adapter is required for wireless connectivity. The B850M DS3H WiFi6E is the direct wireless equivalent.

⚠️ Only four fan headers are present. Builds with more than two chassis fans will need a fan splitter or hub.

⚠️ Integrated display output (dual DisplayPort + HDMI) requires a Ryzen processor with integrated Radeon graphics. Non-G Ryzen 7000/9000 CPUs require a discrete GPU.

Key Highlights

  • AMD B850 chipset, Socket AM5 — CPU overclocking supported
  • Supports Ryzen 7000, 8000, and 9000 Series
  • Micro-ATX form factor
  • 4+4 parallel phase VRM (8 effective phases)
  • 6-layer, 2oz copper PCB, premium chokes and capacitors
  • Single 8-pin ATX12V CPU power connector
  • 4× DDR5 DIMM slots, dual-channel, up to 256 GB, DDR5-8200 (OC)
  • AMD EXPO and XMP memory profile support
  • 1× M.2 PCIe 5.0 x4 (CPU, 128 Gb/s, up to 25110/22110/2580/2280, no heatsink) — M2A_CPU
  • 1× M.2 PCIe 4.0 x4 (CPU, 64 Gb/s, 22110/2280, no heatsink) — M2B_CPU (x2 with Ryzen 8000 Phoenix 2)
  • No chipset M.2 slot — two M.2 slots only
  • 4× SATA 6Gb/s ports
  • RAID 0/1/5/10 NVMe (RAID 5 on Ryzen 9000 only) / 0/1/10 SATA
  • 1× PCIe 5.0 x16 (primary GPU, PCIe UD Slot — Ryzen 7000/9000) / PCIe 4.0 x8/x4 (Ryzen 8000)
  • 1× PCIe 3.0 x4 (chipset)
  • Dual DisplayPort 1.4 (4K 144Hz each) + HDMI 2.1 (4K 60Hz) — triple display (iGPU only)
  • Realtek 2.5GbE LAN
  • No onboard Wi-Fi — wired-only, no M.2 Key E slot
  • 9× rear USB: Type-C Gen2 (10 Gbps) + Gen2 Type-A (10 Gbps) + 2× Gen1 Type-A (5 Gbps) + 4× USB 2.0
  • PS/2 keyboard/mouse combo port — rear
  • Front USB Type-C Gen2 header (10 Gbps) + Gen1 header (2 ports) + 2× USB 2.0 headers (4 ports)
  • 1× CPU fan + 1× CPU fan/pump + 1× system fan + 1× system fan/pump headers — Smart Fan 6, FAN STOP
  • 3× Addressable Gen2 (ARGB) headers + 1× RGB LED header — RGB Fusion 2.0
  • Onboard reset button
  • Debug boot LEDs (CPU/DRAM/VGA/BOOT)
  • EZ-Latch on PCIe x16 slot
  • X3D Turbo Mode BIOS feature
  • Q-Flash Plus (BIOS update without CPU/RAM)
  • SPI TPM header
  • Realtek ALC897 HD Audio, high-end audio capacitors

 

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Additional information

Weight 1 kg
Dimensions 24.4 × 24.4 × 1 cm
Model

MB-GB850MDS3H

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